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IISc Scientists Pitch Game-Changing Chip Tech to Centre: Angstrom-Scale Semiconductors with 2D Materials

By: Editorial Desk

by Editorial Desk
April 21, 2025
in Governance, Technology
Reading Time: 2 mins read
The Union Cabinet has approved a sixth semiconductor manufacturing unit, a joint venture between HCL and Foxconn. Located near UP's Jewar Airport, the Rs 3,700 cr plant will produce display driver chips.

The Union Cabinet has approved a sixth semiconductor manufacturing unit, a joint venture between HCL and Foxconn. Located near UP's Jewar Airport, the Rs 3,700 cr plant will produce display driver chips.

Summarize with:

New Delhi: A 30-member scientific team from the Indian Institute of Science (IISc) has submitted a proposal to the Centre to develop next-generation angstrom-scale semiconductor chips, positioning India at the forefront of the global race beyond silicon.

The ambitious plan, if approved, would mark a major shift in India’s semiconductor strategy by leveraging cutting-edge 2D materials such as graphene and transition metal dichalcogenides (TMDs).

As reported, the proposal, first submitted to the Office of the Principal Scientific Adviser (PSA) in April 2022 and revised in October 2024, outlines the development of chips that are nearly one-tenth the size of the current smallest chips, three nanometers, produced by global giants like Samsung and MediaTek.

The project was subsequently shared with the Ministry of Electronics and IT (MeitY), where it remains under active discussion.

Unlike conventional silicon-based chips, which dominate today’s semiconductor landscape, 2D materials promise to push boundaries at the angstrom level, unlocking new possibilities for ultra-compact, energy-efficient computing.

The IISc-led initiative seeks Rs 500 crore in funding over five years and includes a roadmap for achieving self-sufficiency after the initial government support.

“MeitY is optimistic about the initiative,” said an official involved in the evaluation. Apparently, high-level meetings have already taken place, and potential applications in electronics are being explored.

India, currently reliant on imports, has begun building its domestic capability through major investments such as the Rs 91,000 crore chip fabrication plant by Tata Electronics in partnership with Taiwan’s PSMC.

Globally, research in 2D semiconductor materials has gathered momentum. Europe has already allocated over $1 billion, while South Korea has committed more than $300 million.

Other nations, including China and Japan, are also advancing rapidly in this domain, though with less public disclosure.

According to the PSA’s website, discussions on the IISc proposal date back to 2021, with inputs sought from key stakeholders including DRDO, the Department of Space, and NITI Aayog, which backed the project in 2022.

However, experts caution that India must scale up its efforts quickly or risk missing a critical opportunity in the global semiconductor transition.

Also read –
DTU Gets Semiconductor Centre of Excellence Named After Vinod Dham to Promote Chip Design
Summarize with:
Tags: Chip manufacturingIIScMeitySemiconductors
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