New Delhi,May 25(CXO Media): Huawei has outlined a new roadmap for chip development as US restrictions continue to limit China’s access to advanced semiconductor technology.
At the 2026 IEEE International Symposium on Circuits and Systems (ISCAS) in Shanghai, Huawei said it expects to design high-end chips with transistor density comparable to 1.4-nanometre processes by 2031. The company introduced what it calls the Tau Scaling Law, a chip design approach focused on improving performance without depending only on smaller transistors.
Huawei’s New Semiconductor Strategy
Huawei’s semiconductor business president, He Tingbo, said the company is working on reducing the time taken for signals and data to move inside chips and computing systems. The approach is aimed at improving computing efficiency despite restrictions on access to advanced lithography equipment imposed by the United States.
The announcement comes at a time when China’s semiconductor sector is trying to reduce reliance on foreign technology as export controls continue to tighten.
Kirin Chips To Use LogicFolding Architecture
Huawei also said its Kirin chips, expected to launch in late 2026, will be the first to use a new architecture called LogicFolding, which is designed to shorten internal wiring and improve performance. The company claimed it has already designed and mass-produced 381 chips over the past six years based on principles linked to the Tau Scaling Law for smartphones, AI computing, and industrial use.
Huawei did not release independent performance data, but the company’s 1.4nm target places its ambitions close to the expected global semiconductor frontier for the next decade.
