Mohali: The Central government has issued a Request for Proposal (RFP) for the augmentation and enhancement of the existing 8-inch semiconductor fabrication facility at the Semi-Conductor Laboratory (SCL) in Mohali, Punjab.
This initiative, led by the Ministry of Electronics and Information Technology (MeitY), aims to modernize SCL’s semiconductor manufacturing capabilities to support India’s growing needs in technology and research.
What is the RFP About?
The RFP seeks experienced contractors to upgrade SCL’s 8-inch fabrication (fab) facility with a focus on increasing production capacity, enhancing technological capabilities, and ensuring operational continuity.
The project is divided into bid packages, each covering different aspects of the augmentation process:
- Bid Package 1 – Infrastructure modernization, including cleanroom enhancements, utility upgrades, and the installation of new semiconductor equipment.
- Bid Package 2 – Acquisition and integration of new semiconductor process technologies such as RF-CMOS, BCD (HV LDMOS), and CMOS Image Sensors (CIS).
- Bid Package 3 – Implementation of a Manufacturing Execution System (MES) for automation and process control.
Why is this Upgrade Needed?
SCL in Mohali, an autonomous body under MeitY, is India’s only integrated semiconductor manufacturing facility. Established in 1983, it has played a crucial role in designing and developing microchips, including Very Large-Scale Integrated Circuits (VLSIs), for various applications.
However, to keep pace with global technological advancements, SCL needs significant enhancements in its production capabilities.
The modernization effort aligns with the Government of India’s broader semiconductor mission, which aims to establish a robust domestic chip-making ecosystem under the ‘Atmanirbhar Bharat’ initiative.
Key Upgrades Planned
- Capacity Expansion: The fab’s production will be increased to at least 1,500 wafers per month.
- Technology Enhancement: SCL will integrate new semiconductor technologies, allowing the facility to support cutting-edge applications in government, academia, and industry.
- Operational Continuity: The upgraded fab will improve efficiency, reliability, and customer commitment.
The Bidding Process
The selection process for contractors will occur in two stages:
- Stage 1: Submission and evaluation of technical bids.
- Stage 2: Shortlisted bidders will submit financial bids, and the lowest bid (L1) will be selected.
“In Stage 1 of the bidding process, only technical bids are to be submitted. Please note that No Commercial bids should be uploaded in Stage 1 of the bidding process,” the RFP states.
Key dates include:
- RFP Issuance: 19 February 2025
- Pre-qualification Bid Submission Deadline: 1 April 2025
- Financial Bid Submission Deadline: 27 May 2025
- Contract Signing: Within 30 days of bid finalization
Future Impact
This upgrade is expected to enhance India’s self-reliance in semiconductor manufacturing and support strategic sectors such as defence, space, and telecom.
By upgrading the 8-inch fab, India is taking a crucial step toward reducing dependency on semiconductor imports and fostering innovation within the country.
The RFP outlines a detailed plan for execution, ensuring a structured and transparent process. Interested companies with expertise in semiconductor fabrication are invited to participate, contributing to India’s vision of becoming a global semiconductor hub.
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