New Delhi: India has taken a step forward in semiconductor manufacturing, with RRP Electronics exporting the country’s first batch of packaged semiconductor chips.
The Maharashtra-based firm, which operates an Outsourced Semiconductor Assembly and Testing (OSAT) facility, shipped Application-Specific Integrated Circuits (ASICs) worth approximately Rs 6.51 crore to a European client.
Expanding Semiconductor Capabilities
RRP Electronics is expanding its semiconductor operations under the state-backed Rs 12,035 crore Phase-I plan. The company has partnered with AMB Taiwan to strengthen its technological capabilities.
A specialized team from AMB Taiwan is set to arrive in April to finalize the proof of concept for SIM card modules, aiming to tap into the growing demand for secure telecommunications technology.
Plans for Advanced Chip Production
Beyond SIM card modules, RRP Electronics is moving into Insulated Gate Bipolar Transistor (IGBT) and Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) production.
These components are widely used in power electronics and renewable energy systems, aligning with India’s efforts to build a self-reliant semiconductor industry.
New Packaging Foundry for Apple Supply Chain
The company is also working with Deca Technologies to establish an advanced packaging foundry.
This facility aims to supply components for Apple iPhones, a move that could enhance India’s role in the global electronics supply chain. Additionally, RRP Electronics is developing an Overhead Hoist Transport (OHT) facility, a step towards meeting international semiconductor manufacturing standards.
Automotive and Analog Device Expansion
RRP Electronics is expanding into analog device manufacturing, targeting applications in the automotive sector. This move aligns with the growing demand for semiconductor components in electric vehicles and industrial automation.
The company’s expansion is expected to generate jobs and support India’s push for local semiconductor production under the Make in India initiative.
