Mumbai: RRP Electronics Limited has acquired a 101-acre industrial land parcel in Maharashtra as part of its plan to build a large, integrated semiconductor manufacturing and advanced packaging campus in the state.
The Navi Mumbai-based firm has been allotted Industrial Plot No. A-1 in the Khalapur Phase-3 and Expansion Industrial Area. Spread over nearly 410,000 square metres, the proposed facility will host multiple Outsourced Semiconductor Assembly and Test (OSAT) lines, advanced wafer-level packaging (WLP) units and, subject to approvals, potential semiconductor fabrication facilities.
Chairman Rajendra Chodankar termed the land allocation a key step in the company’s long-term expansion strategy. He said the campus will be developed in phases, integrating packaging and advanced wafer-level capabilities, with the possibility of adding fabrication capacity over time.
RRP has earmarked Rs 12,035 crore for Phase I and Rs 24,000 crore for Phase II, taking the total planned investment beyond Rs 36,000 crore. The integrated model is designed to generate operational efficiencies and enable future scalability as demand rises.
The company currently operates an OSAT unit in Mahape serving automotive, industrial and telecom segments. The Khalapur project is expected to significantly enhance its presence across high-growth sectors, including consumer electronics.
Chodankar said the expansion aligns with the government’s semiconductor push under the India Semiconductor Mission and Atmanirbhar Bharat initiative, aimed at strengthening domestic chip manufacturing capabilities.
