Bhubaneswar, 20 Apr, (APAC Media): India’s first 3D chip packaging facility is coming up soon in Bhubaneswar backed by both central and state incentives.
It will be a greenfield unit to be set up by Heterogeneous Integration Packaging Solutions, the Indian Army’s of US-based 3D Glass Solutions with backing from MeitY.
The total project costs Rs 1943.53 crore and focuses on advanced heterogeneous integration and embedded glass substrate technologies.
Out of this the central government will provide Rs 799 crore while the Odisha government will provide Rs 399.5 crore.
This unit will function as a vertically integrated ATMP (Assembly, Testing, Marketing and Packaging) unit.
The project will cater to sectors like AI, HPC, telecom, defence electronics and aerospace and could localize high-end chip manufacturing capabilities and reduce dependence on imports.
The factory targets to start commercial production by August 2028 with full-scale capacity utilisation expected by August 2030.
It is expected to also generate sufficient employment opportunities across engineering, diploma and vocational segments. At the same time, it will catalyzer ancillary industries.
