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New Delhi, September 2(APAC Media): India has notified the Semicon 2.0 scheme, widening its focus from chip manufacturing to other key areas of the semiconductor sector.
The notifications were issued on August 31 after a press briefing chaired by Union Minister Ashwini Vaishnaw. The scheme covers six areas that the government wants to develop as part of India’s semiconductor ecosystem.
The notifications were issued on August 31 after a press briefing chaired by Union Minister Ashwini Vaishnaw. The scheme covers six areas that the government wants to develop as part of India’s semiconductor ecosystem.
The six areas include chip design, semiconductor machines and materials, new semiconductor fabs, ATMP and OSAT facilities, research and development, and talent development.
Semicon 2.0 is not limited to setting up fabrication plants. It also covers companies working on chip design, semiconductor equipment, materials and advanced packaging.
The scheme also puts focus on semiconductor research and skilled talent. The government plans to support R&D in advanced semiconductor technologies and increase the number of engineers trained in the sector.
What Semicon 2.0 Covers
The scheme will support projects across different parts of the semiconductor value chain, including chip design, fabrication, packaging, equipment and materials.
The India Semiconductor Mission will oversee the implementation of the scheme and evaluate applications.
The India Semiconductor Mission will oversee the implementation of the scheme and evaluate applications.
The government had earlier approved ₹1.27 lakh crore for Semicon 2.0. Applications under the scheme will remain open for three years, while approved projects can run for up to six years.
With the new framework, the government’s semiconductor push is moving beyond fabs and towards building a wider chip ecosystem in India.
With the new framework, the government’s semiconductor push is moving beyond fabs and towards building a wider chip ecosystem in India.
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